Packaging Lead EOL (Jagiroad)

Responsibilities: We are seeking an experiencedIC Package EndofLine (EOL) QA Test Lead with a robust background in OSAT operations, semiconductor packaging, and highvolume manufacturing quality systems. The ideal candidate will lead EOL process quality, drive test strategy, and ensure robust product reliability through collaboration with OSAT partners, internal product engineering, and crossfunctional teams. Key Responsibilities EOL Process Ownership
- Lead and oversee all EndofLine (EOL) processes such as final test, visual inspection, packing, marking, and tape reel.
- Define and optimize EOL workflows, procedures, and specifications to ensure consistent product quality and throughput.
- Conduct process audits, identify gaps, and drive corrective and preventive actions (CAPA). Quality Assurance Test Leadership
- Own QA strategy for IC packaging, including quality planning, risk management (PFMEA), and compliance with industry standards.
- Define and maintain test coverage, test limits, and quality control plans for production at OSAT sites.
- Perform yield analysis, test data review, failure traceability, and rootcause analysis for test escapes or quality excursions.
- Lead MRB (Material Review Board) activities for EOL defects and support containment actions. OSAT Partner Management
- Act as the primary technical interface with OSAT assembly test partners.
- Ensure partner adherence to defined process controls, QC requirements, and test execution procedures.
- Review and approve OSAT qualification packages, process changes, and engineering validation results. New Product Introduction (NPI)
- Support NPI programs by defining EOL readiness, test program maturity, and qualification test plans.
- Drive DFT/DFM/DFx discussions to ensure manufacturability and testability at scale.
- Oversee pilot runs, engineering builds, and ramptohighvolume manufacturing (HVM). DataDriven Quality Improvements
- Utilize statistical tools (SPC, DOE, Minitab/JMP) to identify trends and drive continuous improvement.
- Develop dashboards for yield, quality metrics, outgoing quality, and customer returns.
- Conduct deep dives into CPK, OEE, and correlation/GRR activities for test equipment. Compliance Documentation
- Ensure compliance with JEDEC, IPC, automotive (AECQ100), and customerspecific standards.
- Maintain robust documentation (Control Plans, SOPs, Work Instructions, IQC/OQC standards).
- Support customer audits and provide technical justifications where needed. Essential Attributes
- EOL processes (final test, marking, packing, visual inspection)
- QA methodologies quality systems
- Failure analysis and DOE methodology Qualifications Bachelors/Masters in Materials, Mechanical, Electronics, Packaging, or Manufacturing Engineering (or related). Responsibilities: We are seeking an experiencedIC Package EndofLine (EOL) QA Test Lead with a strong background in OSAT operations, semiconductor packaging, and highvolume manufacturing quality systems. The ideal candidate will lead EOL process quality, drive test strategy, and ensure robust product reliability through collaboration with OSAT partners, internal product engineering, and crossfunctional teams. Key Responsibilities EOL Process Ownership
- Lead and oversee all EndofLine (EOL) processes such as final test, visual inspection, packing, marking, and tape reel.
- Define and optimize EOL workflows, procedures, and specifications to ensure consistent product quality and throughput.
- Conduct process audits, identify gaps, and drive corrective and preventive actions (CAPA). Quality Assurance Test Leadership
- Own QA strategy for IC packaging, including quality planning, risk management (PFMEA), and compliance with industry standards.
- Define and maintain test coverage, test limits, and quality control plans for production at OSAT sites.
- Perform yield analysis, test data review, failure traceability, and rootcause analysis for test escapes or quality excursions.
- Lead MRB (Material Review Board) activities for EOL defects and support containment actions. OSAT Partner Management
- Act as the primary technical interface with OSAT assembly test partners.
- Ensure partner adherence to defined process controls, QC requirements, and test execution procedures.
- Review and approve OSAT qualification packages, process changes, and engineering validation results. New Product Introduction (NPI)
- Support NPI programs by defining EOL readiness, test program maturity, and qualification test plans.
- Drive DFT/DFM/DFx discussions to ensure manufacturability and testability at scale.
- Oversee pilot runs, engineering builds, and ramptohighvolume manufacturing (HVM). DataDriven Quality Improvements
- Utilize statistical tools (SPC, DOE, Minitab/JMP) to identify trends and drive continuous improvement.
- Develop dashboards for yield, quality metrics, outgoing quality, and customer returns.
- Conduct deep dives into CPK, OEE, and correlation/GRR activities for test equipment. Compliance Documentation
- Ensure compliance with JEDEC, IPC, automotive (AECQ100), and customerspecific standards.
- Maintain robust documentation (Control Plans, SOPs, Work Instructions, IQC/OQC standards).
- Support customer audits and provide technical justifications where needed. Essential Attributes
- EOL processes (final test, marking, packing, visual inspection)
- QA methodologies quality systems
- Failure analysis and DOE methodology Qualifications Bachelors/Masters in Materials, Mechanical, Electronics, Packaging, or Manufacturing Engineering (or related). Apply on Kit Job: kitjob.in/job/4md76h