Process Engineering SME (Assam)

Job ID: 39380 Date: 22 May 2026 Location: Jagiroad, AS, IN Department: Assembly Technology Development Business: TSAT India Responsibilities:
- Technology & Process Leadership.
- Own end-to-end process integration for
- Wafer /Die Preparation (Wafer thinning, Dicing (Laser, Mechanical), 2nd optical Inspection)
- Die attach (Direct, Flipchip, Thin die, Epoxy, Film, Sintering)
- Wire bond (Au, CuPd, Al, Ball Bond, Wedge Bond)
- Underfill, Plasma clean
- Taping & 3rd Optical
- Encapsulation (Transfer Mold, Compression Mold and Lid attach)
- Plating & Marking
- Solder ball attach, Reflow and Flux cleaning
- Package Separation (Cutting, Forming, Singulation) & FV Inspection.
- Define and maintain process windows, control plans and CTQ across all package families.
- Lead technology qualification, scaling from development to high volume manufacturing.
- Drive technology/process roadmaps aligned to customer, market and package needs.
- NPI & Manufacturing Readiness.
- Lead EVT/ DVT / PVT readiness from a process perspective.
- Partner with NPI, Product Engineering, and TD to ensure DFM and DFR.
- Ensure smooth technology transfer from development to production.
- Own ramp-up metrics: yield learning curve, cycle time, scrap reduction.
- Yield, Reliability & Quality Excellence.
- Accountable for first pass yield, final yield and field reliability.
- Lead root cause analysis for yield excursions using SPC, FMEA, DOE and failure analysis.
- Own JEDEC reliability qualification of the packages/devices.
- Partner with Quality team to address customer returns, audits and escalations.
- Equipment Supplier Management
- Provide technical leadership for process equipment selection, buyoff and productivity improvement.
- Support CAPEX planning and ROI justification.
- Cost, Productivity & Operational Excellence.
- Own cost of ownership and productivity improvement initiatives.
- Drive OEE, Cycle time and line balancing improvements.
- Lead automation, digitalization and smart manufacturing initiatives.
- Support factory expansion and greenfield/ brownfield setups.
- Organization and Talent leadership.
- Build and lead high performance process engineering organizations including SMEs.
- Mentor Senior Engineers and SMEs.
- Define competency frameworks, training roadmaps and succession plans.
- Foster a culture of technical rigor, accountability, and continuous improvement.
- Implement and monitor company values.
- Customer & Stakeholder Engagement.
- Serve as a technical authority for customers on packaging process topics.
- Lead customer reviews, technology discussions and risk mitigation plans.
- Support business development with technology feasibility and cost modeling.
- Represent process engineering in executive and customer forums. Key Deliverables & KPI
- Yield and Reliability Performance.
- Cost reduction and productivity improvement.
- NPI cycle time and ramp success.
- Customer satisfaction and audit outcomes.
- Talent retention and Capability maturity. Essential Attributes:
- Experience in high volume and high package /device mix manufacturing workplace.
- Demonstrated success in yield improvement, reliability qualification and cost reduction. Qualification:
- Bachelor / master in related Engineering Discipline (Preferred Mechanical, Electronics). Desired Experience Level:
- 5-7 years’ experience in OSAT industry in a similar role.
- 15-20 years Semiconductor IC Packaging and Assembly. Apply on Kit Job: kitjob.in/job/4ltcl8